电子组装的IPC标准列表0电流保险丝
时间：2022/09/17 20:27:03 编辑：
电子组装的IPC标准列表
电子组装的IPC标准列表 2011年12月10日 来源： IPC-T-50G Terms and Definition for Interconnecting and Packaging Electronic Circuits 电子电路互连与封装的定义和术语
IPC-TM-650 Test Methods Manual
试验方法手册
IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies
电气与电子组装件锡焊要求
IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1
J-STD-001辅助手册及指南及修改说明1
IPC-A-610D Acceptability of Electronic Assemblies
印制板组装件验收条件
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison
IPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-K Electronic Assembly Reference Set
电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
电缆和引线贴装的要求和验收
IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology
倒装芯片及芯片级封装技术的应用
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation
芯片直装技术实施导则
IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications
倒装芯片用半导体设计标准
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
FC（倒装片）和CSP(芯片级封装)的外形轮廓标准
IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
倒装芯片及芯片级凸块结构的性能标准
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology
球栅阵列 (BGA)及其它高密度封装技术的应用
IPC-7095 Design and Assembly Process Implementation for BGAs
球栅阵列的设计与组装过程的实施
IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls
BGA球形凸点的标准规范
IPC-MC-790 Guidelines for Multichip Module Technology Utilization
多芯片组件技术应用导则
IPC-M-108 Cleaning Guides and Handbook Manual
清洗导则和手册
IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards
非密集型印制板清洁应用导则
IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?
电路板离子洁净度测量：它告诉我们什么？
IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies
印制板及组装件清洗导则
IPC-SC-60A Post Solder Solvent Cleaning Handbook
锡焊后溶剂清洗手册
IPC-SA-61A Post Solder Semi-aqueous Cleaning Handbook
锡焊后半水溶剂清洗手册
IPC-AC-62A Aqueous Post Solder Cleaning Handbook
锡焊后水溶液清洗手册
IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies
电化学迁移：印制电路组件的电气诱发故障
IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air
IPC第3阶段非清洗助焊剂研究
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing
深入离子洁净度测试
IPC-9201 Surface Insulation Resistance Handbook
表面绝缘电阻手册
IPC-TP-104-K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,
Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分
IPC-M-109 Component Handling Manual
元件处理手册
IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices